Mechanical Engineer, Electronics Packaging, Quantum AI
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Minimum qualifications:
- Bachelor's degree in Mechanical Engineering, Product Design, Electrical Engineering, a related field, or equivalent practical experience.
- 4 years of experience in design and analysis of electro-mechanical systems and products (e.g., sheet metal, injection molding, structural and thermal analysis).
- Experience with Design for Manufacturing (DFM) and Geometric Dimensioning and Tolerances (GD&T).
- Experience using computer-aided design tools (e.g., OnShape, NX, Creo, or Solidworks).
Preferred qualifications:
- Master's degree or PhD in Mechanical Engineering, Electrical Engineering, Computer Engineering, Physics, or a related field.
- Experience with mechanical engineering and design principles in the areas of Computer Numerical Control (CNC) machining, Electrical Discharge Machining (EDM), forming, sheet metal, and structural analysis.
- Experience with electrostatic discharge sensitive devices.
- Experience with clean room and cryogenic environments.
- Experience in designing complex electro-mechanical assemblies, with an understanding of mechanical tolerances and tolerance analysis.
About the job
As a mechanical engineer, you will work with other hardware engineers to design, build, and test electronics packaging for our quantum processors and other adjacent cryogenic hardware. You will ensure that our next generation of packaging matures quickly and efficiently by performing detailed design work, defining and verifying mechanical requirements, and ensuring industry standard design and manufacturing principles are being followed. You will build scalable and reliable electronics for the next level of computing.
The full potential of quantum computing will be unlocked with a large-scale computer capable of complex, error-corrected computations. Google Quantum AI's mission is to build this computer and unlock solutions to classically intractable problems. Our roadmap is focused on advancing the capabilities of quantum computing and enabling meaningful applications.
The US base salary range for this full-time position is $117,000-$172,000 + bonus + equity + benefits. Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target salaries for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.
Responsibilities
- Collaborate with adjacent teams to mature design, assembly, test, and managing workflows for new electronics packages and test setups.
- Define mechanical requirements for quantum packages and other critical interfaces.
- Perform detail design to support production and Research and Development (R&D) electronics packaging.
- Write and execute test plans to vet designs prior to deployment.
- Develop prototype designs into a production environment.
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