Senior Silicon Emulation Engineer, Performance Modeling and Analysis
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Minimum qualifications:
- Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
- 5 years of experience with C or C++ programming.
Preferred qualifications:
- Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science.
- Experience with computer architecture with ARM or RISC-V.
- Experience in bus interconnection like AXI/APB in AMBA protocols.
- Experience with SystemC or Register-Transfer Level (RTL).
- Experience in software-based architecture simulators or Field-programmable Gate Array/Application-Specific Integrated Circuit (FPGA/ASIC) based emulation platforms.
- Experience with performance evaluation for mobile or Internet of Things (IoT) devices.
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration. Google's mission is to organize the world's information and make it universally accessible and useful. Our team combines the best of Google AI, Software, and Hardware to create radically helpful experiences. We research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. We aim to make people's lives better through technology.Responsibilities
- Develop simulation models at different abstraction levels (e.g., Cycle Accurate/Functional).
- Build models for System on a chip (SoC) components like processors, machine learning accelerator, memory subsystem, bus interconnect, and other peripherals.
- Perform system level modeling for SoC architecture and performance exploration and analysis.
- Collaborate with cross-functional teams to debug failures (e.g., boards, software, manufacturing, design, thermal issues, etc.).
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