Senior Silicon ASIC/SOC Reliability Engineer
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Minimum qualifications:
- Bachelor's Degree in Materials Science, Electrical Engineering, or Mechanical Engineering, or equivalent practical experience.
- 6 years of experience in design, development, reliability qualification, and production of advanced ASIC/SOC packages, including FCBGA, InFO, FOPLP, WLCSP, IPOP, 2.5D and 3D packages.
- Experience in semiconductor failure analysis tools, such as SEM, TEM, FIB, EDX, CSAM, Nanoprobe, CT Scan, and X-Ray.
Preferred qualifications:
- Master's degree or PhD in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, related degree or equivalent practical experience.
- Experience in FEA of advanced materials and packages in Si 5-3nm FinFET technologies.
- Experience in reliability testing, physics, statistical analysis (Design Expert, JMP, Weibull), lifetime, FIT, failure rate projection of semiconductor devices and components.
- Experience in package and board-level reliability testing (JEDEC qualification, TCoB, Mechanical Shock, Shadow Moire, MLB board strain).
About the job
As a Reliability Engineer, you will play a key role in creating new consumer electronic products that meet a high bar for reliability and performance. You will work closely with the product management and design engineering teams to define standards, specify tests, and then supervise test execution and failure analysis. A broad engineering background and command of statistical methods will help to inform design of new products. Your strong communication skills will be key to ensuring adoption of your technical recommendations.
In this role, you will design, develop, and assess the reliability of advanced ASIC/SOC packages for consumer hardware. Your work involves new technology development, board-level reliability studies, lifetime projections, failure analysis, and FEA to meet performance specs. You will quantify the impact of material properties, warpage, and fatigue on package integrity, while studying underfill reliability and manufacturability. You will work with cross-functional teams and external suppliers, you will ensure packaging solutions meet system-level reliability standards.
Google's mission is to organize the world's information and make it universally accessible and useful. Our team combines the best of Google AI, Software, and Hardware to create radically helpful experiences. We research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. We aim to make people's lives better through technology.
Responsibilities
- Lead the reliability of advanced IC package technology for SoCs designed in 5-3nm FinFET technologies and beyond.
- Conduct board-level reliability tests, such as temperature cycling on board (TCoB), mechanical shock, planarity and warpage, and board-level strain to generate physical model parameters for the FEA analysis.
- Conduct failure analysis of solder balls, bumps, package substrates, RDL, and IMC at the solder/pad interface to determine the root cause of failures in reliability testing. Employ FEA to assess reliability of advanced ASIC/SOC packages on system boards.
- Study the manufacturing robustness and reliability of underfill materials on advanced SoC packages and system boards.
- Use statistical reliability analysis tools, such as JMP and Weibull, to model the experimental data and project lifetime of the packages under field applications.
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