Packaging Engineer, Custom Silicon Operations
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Minimum qualifications:
- Bachelor's degree in Electrical Engineering, Computer Engineering, Material Engineering, or equivalent practical experience.
- 8 years of experience as a Semiconductor Packaging Engineer.
- Experience with semiconductor advanced packaging technologies, assembly processes, IC packaging materials, reliability standards, and Failure Analysis (FA) techniques.
- Experience with technical leadership.
Preferred qualifications:
- Master's degree or PhD in Electrical Engineering, Computer Engineering, Material Engineering, or a related field.
- Experience with SoC and Power Management Integrated Circuit (PMIC) productization.
- Experience in data analysis using semiconductor production data.
- Understanding of advanced packaging, 2.5D packaging, and 3D packaging technologies.
- Ability to work in a fast-paced, rapidly changing environment.
About the job
Google’s custom silicon Sourcing and Operations team is responsible for all external manufacturing engagement and supplier management for the Foundry and Outsource Assembly and Test (OSAT) partners for custom silicon for Google’s consumer hardware products. The organization is responsible for managing custom silicon manufacturing solutions to enable Google to deliver product introduction and ramp to meet schedule, quality, and cost goals. This includes Foundry and OSAT sourcing, supplier management, end-to-end planning and procurement, execution of development and manufacturing operations with our suppliers in partnership with Google Engineering Business units. It also includes strategy development and orchestration with key stakeholders to shape the supply ecosystem for better partnership, capacity flexibility, high quality, business continuity, and cost effectiveness.
As a Packaging Engineer for Custom Silicon, you will join the team responsible for high volume Custom Silicon Manufacturing from NPI through product ramp, sustaining, and End of Life (EOL). You will manage process improvement and scrap optimization, manufacturing performance, quality and excursion management and prevention, value engineering, change control management, new production site qualifications for alternate sourcing and business continuity, High Volume Manufacturing (HVM) capacity readiness, cycle time optimization and more.
Google's mission is to organize the world's information and make it universally accessible and useful. Our Devices & Services team combines the best of Google AI, Software, and Hardware to create radically helpful experiences for users. We research, design, and develop new technologies and hardware to make our user's interaction with computing faster, seamless, and more powerful. Whether finding new ways to capture and sense the world around us, advancing form factors, or improving interaction methods, the Devices & Services team is making people's lives better through technology.
Responsibilities
- Follow responsibilities in the area of custom silicon package process definition, yield monitoring and yield improvement, excursion management and failure analysis.
- Drive and resolve technical and operational issues of material, process, fixtures and equipment to enable delivery of product and manufacturing process from New Product Introduction (NPI) to mass production.
- Lead early production site qualifications for NPI, and lead yield and process improvements.
- Lead excursion root cause analysis, and lead suppliers to establish and validate process capability and performance metrics (using statistical tools and techniques) for consistently delivering quality products and for excursion management.
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