Senior Engineering Manager, Structural and Thermal Analysis
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Minimum qualifications:
- Bachelor's degree in Mechanical Engineering, Product Design, or related field, or equivalent practical experience.
- 12 years of experience designing mechanical components such as plastic or metal parts, mechanical assemblies, printed circuit boards, or flexes.
- 8 years of experience in design, analysis (including thermal/structural analysis), shipping consumer hardware with thermal or structural needs, and IoT experience.
- Experience with 3D CAD systems (e.g., NX, Pro/Engineer, SolidWorks, etc.).
- Experience managing engineering teams.
Preferred qualifications:
- Master's degree in Mechanical Engineering, Product Design, or related field, or equivalent practical experience.
- Knowledge of cooling strategies used at the package, board, and system-levels with successful application of advanced cooling technologies.
- Knowledge of consumer electronics architecture and system design methodologies.
- Ability to manage project priorities and technical resources.
- Excellent cross-functional communication skills.
About the job
As a member of a fast-paced multi-disciplinary team, you use your creativity and diverse range of engineering experience to explore solutions to a variety of engineering problems. As a mechanical engineer, you participate in the design, analysis, and prototyping of new concepts. You work in a manufacturing and product oriented development environment and collaborate with vendors and outside sources in order to see parts through to manufacture.
The Google Pixel team focuses on designing and delivering the world's most helpful mobile experience. The team works on shaping the future of Pixel devices and services through some of the most advanced designs, techniques, products, and experiences in consumer electronics. This includes bringing together the best of Google’s artificial intelligence, software, and hardware to build global smartphones and create transformative experiences for users across the world.
The US base salary range for this full-time position is $214,000-$305,000 + bonus + equity + benefits. Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target salaries for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.
Responsibilities
- Build and lead structural and thermal mechanical simulation teams and lead development efforts related to thermally and structurally modeling small form factor computing devices with a variety of heat sources (e.g., chipsets, memory, screens, radios, sensors).
- Lead mechanical and thermal design, including requirements gathering, concepts generation, analysis/verification testing, cross-functional reviews, and manufacturing release.
- Establish simulation best practices and standards and perform model verification, calibration, and validation to improve the predictability of models.
- Contribute to the overall system architecture and optimize design and architect/influence products by providing mechanical/thermal engineering insight and identify and scope projects around innovation opportunities and risks.
- Work with the design team to provide solutions that reduce risk or anticipated system problems, as well as with manufacturing teams and fabrication vendors.
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Google is a global company and, in order to facilitate efficient collaboration and communication globally, English proficiency is a requirement for all roles unless stated otherwise in the job posting.
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