Semiconductor Process Engineer, Raxium Display Group
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Minimum qualifications:
- Bachelor’s degree in Electrical Engineering, Computer Engineering, Physics, a related field, or equivalent practical experience.
- 4 years of experience working in a Hardware technical environment, or 3 years of experience with an advanced degree.
- Experience with Semiconductor Engineering and Microelectronics Fabrication.
- Experience with Optoelectronics.
Preferred qualifications:
- Master's degree or PhD in Electrical Engineering, Industrial Engineering, Material Science, Operations Management, Computer Science, Physics, or a specialized field or equivalent practical experience.
- Experience in the area of Chip-Level Multi-Processing (CMP) or wafer grinding or wafer bonding.
About the job
Our team combines the best of Google AI, software, and hardware to create radically helpful experiences. We research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. We aim to make people's lives better through technology.
Google's Raxium display group has established a revolutionary semiconductor materials display technology that enables new functionality in display products, bringing to users a closer and more natural linkage between the digital and physical realms in applications such as augmented reality (AR) and light-field display. With start-up roots and a state-of-the-art compound semiconductor fab in Silicon Valley, Raxium is seeking to build upon its engineering team with an aim to disrupt next-generation display markets.Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. Learn more about benefits at Google.
Responsibilities
- Design and develop a new back-end of line (BEOL) capability including chemical mechanical polishing (CMP), wafer grinding, and wafer bonding fabrication.
- Identify and evaluate quality and implement new equipment or upgrades.
- Review, propose, optimize, improve, and implement various wafer fabrication processes for yield improvement, defectivity reduction, and manufacturability.
- Own the area process control plan and enhance the process stability through implementation of best known manufacturing methods and statistical process control (SPC).
- Drive the problem resolution process associated with the quality excursion in the fab area encompassing data analytics, methodical problem solving, failure analysis (FA), design of experiments (DOE), and mistake-proof.
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